Shuttle ASICs
StarGate provides customers a way to cost reduce and invent new products
by providing a low cost, fast, path to custom semiconductors. Our experience
and knowledge addresses the Communications, Consumer Electronics, and Industrial
Control Markets. StarGate knows that the lifecycle for products in these markets
change much faster than the ability to design custom semiconductors. It is
for this reason that building cost competitive products with off-the-shelf
parts has become a real challenge.
StarGate is working with select customers to build ASICs that fit common needs. Because the high cost of ASIC development prohibits many companies from participating, our solution is to match up those customers that have common needs and design a part that serves all of them. The list of parts proposed here specify common core features that fit certain customer profiles and addresses certain market segments.
These parts listed here
are work in progress and thier features are not yet cast in stone. Unless
we indicate a part is going to the foundry, there is time to add or change
requirements if new customers see the need for a similar part. Please consult
our sales department for part status.
The SG802W74 is a full featured MFP (Multi Functional Peripheral) Microcontroller belonging to StarGtate's Hi-End WIcore family. The SG802W74 is an ideal solution for Laser Printers and MFP products requiring direct wireless connectivity to the network.
The SG802W72 is a full featured general purpose Microcontroller belonging to StarGates hi-end WICore family. The SG802W72 is an ideal solution for general purpose products requiring high performance. The ARM7 processor is combined with a variety of industry standard IO interfaces making it a highly integrated single-chip solution. Included is a SDRAM controller allowing up to 1Gbytes of external SDRAM. An external local bus allows additional SRAM and FLASH to be connected.
Our team can help show you how your products can benefit from a highly integrated single-chip solution through reduced cost and power consumption while increasing functionality, performance, and reliability.
For more detailed information on our products, please contact
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Benefits
Integrating semiconductor devices (reducing part count) yields numorous benefits
including reduced product cost and power consumption, and increased product
reliability. This trend has been true for more than 35 years and has been
the reason for the ever increasing complexity of manufacturing semiconductors.
Parts Count
Product planners confront many issues when forecasting how many parts to stock
and are needed to ramp up/down production. Reducing part count can ease this
task by reducing the number of parts vendors. Frequently there are problems
created by the need to qualify multiple vendors to supply multi-sourced parts.
Often components are discontinued which forces a company to do lifetime buys
for parts that are sole sourced, requiring an accurate calculation of product
sales and retirement plans many years into the future.
Power Consumption
Integration of semiconductor components also helps decrease power consumption,
reducing the cost and size of power supplies and increasing battery life of
portable equipment. Excess power consumption creates heat which is a key causal
factor in component failure. Vented enclosures battle this problem but must
rely on optimal ambient temperatures. As a result, many products that are
deployed in wire-closets or industrial or other harsh environments often suffer
from compromised product life.
FCC Compliance
Reducing the number of components also helps decrease RF (Radio Frequencies)
problems allowing easier compliance with FCC Part 15 A/B. More components
generally require larger PCBs (Printed Circuit Boards) and more signal layers
which increase cost. Because the PCB is physically bigger, it creates more
radiation because of the longer signal traces. Numerous product schedules
have slipped because of FCC compliance issues. Vent holes designed in enclosures
must also be designed carefully or they will leak RF energy. Frequently, plastic
enclosures need to be shielded to battle RF emissions emitted by the PCB,
resulting in major cost overruns and schedule slips.
Customers
Our customers are companies manufacturing high-tech products such as Laser
Printers, Internet Appliances, Industrial Controllers, Portable, and Wireless
devices. Our solution supports multiple designs with a common part. StarGate
is developing new SoC technologies that allow multiple
cores to easily integrate on the same chip and allow rapid design cycles for
building complete customized semiconductors. This unique approach not only
shortens design cycles, but also reduces costs and enhances reliability and
testability.